1. 2. 3. material content data sheet sales product name bcr 10pn h6327 issued 29. august 2013 ma# MA001094638 package pg-sot363-6-1 weight* 6.29 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 24 noble metal gold 7440-57-5 0.015 0.24 2392 inorganic material silicon 7440-21-3 0.073 1.17 1.41 11673 14089 leadframe inorganic material silicon 7440-21-3 0.001 0.01 92 non noble metal titanium 7440-32-6 0.003 0.05 458 non noble metal chromium 7440-47-3 0.009 0.14 1375 non noble metal copper 7440-50-8 2.869 45.66 45.86 456473 458398 wire non noble metal copper 7440-50-8 0.010 0.16 0.16 1633 1633 encapsulation organic material carbon black 1333-86-4 0.030 0.48 4830 plastics epoxy resin - 0.653 10.38 103848 inorganic material silicondioxide 60676-86-0 2.353 37.43 48.29 374335 483013 leadfinish non noble metal tin 7440-31-5 0.213 3.39 3.39 33924 33924 plating noble metal silver 7440-22-4 0.056 0.89 0.89 8943 8943 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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